Chips JU RIA Resilience 2026 – Research-Oriented Call on 6G Front-End Modules
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Chips JU RIA Resilience 2026 – forskningsrettet opslag om 6G Front End-moduler | Innovationsfonden
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Chips JU RIA Resilience 2026 – Research-Oriented Call on 6G Front-End Modules

Innovationsfonden
Innovationsfonden

Chips JU RIA Resilience 2026 is a research-oriented call focused on strengthening Europe's position in future 6G communications by developing key microelectronic building blocks for next-generation 6G radio front-end modules. The call addresses higher frequencies, system complexity, and AI-native networks. Danish partners can receive national co-funding through Innovationsfonden for participating in international consortia.

Chi può candidarsi

Open to Danish universities, companies, RTOs, and research organisations that are part of an international consortium with minimum 3 independent legal entities from different EU Member States or Associated Countries.

Vantaggi e benefici

  • Access to Chips JU Competence Center for partner matching
  • Networking with European semiconductor ecosystem
  • Access to Chips JU events and brokerage opportunities
  • Support for consortium agreement negotiations

Contatti chiave

Fonti

Link utilizzati dall'IA per raccogliere informazioni su questa sovvenzione.